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Power chips are attached to outside circuits through packaging, and their efficiency depends upon the support of the product packaging. In high-power scenarios, power chips are typically packaged as power modules. Chip affiliation describes the electric connection on the upper surface area of the chip, which is generally aluminum bonding wire in conventional modules. ^ Traditional power component package cross-section
Currently, business silicon carbide power modules still mostly use the product packaging technology of this wire-bonded conventional silicon IGBT module. They face issues such as large high-frequency parasitical specifications, not enough warmth dissipation capacity, low-temperature resistance, and inadequate insulation strength, which restrict the use of silicon carbide semiconductors. The display of excellent performance. In order to address these issues and totally exploit the substantial potential benefits of silicon carbide chips, several new product packaging innovations and options for silicon carbide power modules have actually emerged recently.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold cord bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold wires to copper wires, and the driving force is expense reduction; high-power tools have developed from light weight aluminum cables (strips) to Cu Clips, and the driving pressure is to boost item performance. The greater the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared with conventional bonding product packaging approaches, Cu Clip modern technology has the complying with benefits:
1. The link between the chip and the pins is constructed from copper sheets, which, to a certain level, changes the common cable bonding method in between the chip and the pins. Therefore, an unique package resistance value, greater present circulation, and much better thermal conductivity can be gotten.
2. The lead pin welding location does not need to be silver-plated, which can totally conserve the expense of silver plating and bad silver plating.
3. The product appearance is entirely regular with regular items and is mainly made use of in servers, portable computers, batteries/drives, graphics cards, motors, power materials, and other areas.
Cu Clip has two bonding approaches.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding technique is more pricey and complex, but it can attain much better Rdson and far better thermal results.
( copper strip)
Copper sheet plus cord bonding approach
The resource pad utilizes a Clip technique, and eviction utilizes a Cable approach. This bonding technique is somewhat cheaper than the all-copper bonding approach, conserving wafer location (relevant to extremely little entrance areas). The process is less complex than the all-copper bonding technique and can obtain far better Rdson and far better thermal effect.
Provider of Copper Strip
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