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Manufacturer of sputtering targets used in the coating, tooling, electronics, solar, glass and metal fabrication industries. Products are fabricated using melting and sintering methods. Sputtering target materials include tantalum (Ta), hafnium, niobium and titanium alloys as well as silver alloys for reflective layer and electrode applications. Custom manufacturing services are available. Products are RoHS and REACH compliant.
The present invention relates to a method for producing a magnesium sputtering target, the method comprising the steps of forming a sputtering target from magnesium by casting, grinding, and bead blasting the sputtering target with zirconia beads to remove machining defects and contaminants from the surface of the sputtering target. The sputtering target is then annealed to remove surface residual stress and to smooth the surface of the sputtering targeting material.
Magnesium is a chemical element with the symbol Mg and atomic number 12. It is an extremely lightweight metal which combines well with other elements to form strong, light alloys. It is the basis for several aluminium alloys and is a component in many copper alloys. It is also added to several nickel alloys to reduce the sensitivity of the alloys to corrosion.
The invention is further described in the following detailed description of exemplary embodiments, which are illustrated by the accompanying drawings. The figures are presented for the purpose of illustrating exemplary embodiments only, and are not intended to limit the scope of the invention in any way. FIG. 2A shows an optical micrograph of the as-machined surface of a ruthenium (Ru) sputtering target prior to a bead blasting treatment. After bead blasting, the sputtering target surface is shown to be free of grinding-induced defects and to be clean and homogeneous.